Combined structure of a thermal chamber and a thermal tower

ABSTRACT

A combined structure of a thermal chamber and a thermal tower, the structure suits heat generating products such as a CPU of a computer, a projector, an LCD color monitor, a TV set etc., and comprises: a hollow vacuum thermal chamber or vapor chamber forming a base, of which the upper surface has at least an opening; and at least a vacuum thermal tower or heat pipe combined with the opening of the vacuum thermal chamber, the inner spaces of the thermal chamber (or vapor chamber) and the thermal tower (or heat pipe) are communicated with each other. Thereby, heat can be fast conducted and scattered through the vacuum thermal chamber or vapor chamber and the vacuum thermal tower or heat pipe.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a combined structure of a thermalchamber and a thermal tower; and especially relates to a heat sinkingdevice of which the base is in the form of a hollow vacuum thermalchamber or vapor chamber, the upper surface of the base is combined withat least a vacuum thermal tower or heat pipe, wherein the inner spacesof the thermal chamber and the thermal tower are communicated with eachother. The structure suits a CPU of a computer, a projector, an LCDcolor monitor, a TV set and other heat generating electronic products.

2. Description of the Prior Art

The art of computer information and techniques of the manufacturers ofit have been developed very fast and updated from day to day, theassemblies in a CPU derived from them have had more and more circuits,thus energy consumption has been continuously increased, and problems ofheat sinking can not help being mentioned again in order that heataccumulation by high speed operation of a CPU in a computer that inducesraising of temperature and damage of the CPU can be avoided. Inconventional CPU heat-sinking devices, it is often seen that a fandriven by electric power scatters heat absorbed by a heat-sinking bodyfrom an heat source object into a sealed housing of a mainframe in orderto get a goal of forced convection; however, this has the defects ofsubstantial electric power consumption, large volume, large noise, slowspeed of heat sinking as well as vibration. And, at present time, thereis a use of a thermal tower having no air pressure, wherein the thermaltower set with working fluid to efficiently increase the speed of heatsinking.

A conventional heat-sinking device also has the chance of using a vacuumthermal tower, as the one shown in FIG. 1, a conventional uprightthermal tower 10 has a bottom 11 thereof welded to a heat-sinking bottomplate 12 to indirectly increase the contact area of the thermal towerwith a heat generating source to increase the effect of heat sinking,however, the speed of heat sinking of it still is limited.

In view of these defects to be gotten rid of and to increase theefficiency of heat sinking, the present invention is developed.

SUMMARY OF THE INVENTION

The primary object of the present invention is to provide a combinedstructure of a thermal chamber and a thermal tower, by mutual connectingof the thermal chamber and the thermal tower, the efficiency of heatsinking can be increased.

To achieve the above stated object, the combined structure of a thermalchamber and a thermal tower of the present invention comprises: a hollowvacuum thermal chamber forming a base, of which the upper surface isprovided at least with an opening; and at least a vacuum thermal towercombined with the opening of the vacuum thermal chamber, the innerspaces of the thermal chamber and the thermal tower are communicatedwith each other. And the thermal tower can be added therearound withheat-sinking fins.

Thereby, heat generating electronic products such as a CPU of acomputer, a projector, an LCD color monitor, a TV set etc. can getexcellent heat-sinking effects by heat conducting by means of the vacuumthermal chamber and the vacuum thermal tower.

The present invention will be apparent after reading the detaileddescription of the preferred embodiments thereof in reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view showing the appearance of aconventional upright hollow thermal tower connected on the bottomthereof a bottom plate;

FIG. 2 is an exploded perspective view showing the appearance of a firstembodiment of the combined structure of a vacuum thermal chamber and avacuum thermal tower of the present invention;

FIG. 3 is an exploded perspective view showing the appearance of asecond embodiment of the combined structure of a vacuum thermal chamberand a vacuum thermal tower of the present invention;

FIG. 4 is an analytic perspective view showing the combined structure ofthe second embodiment of the combined structure of a vacuum thermalchamber and a vacuum thermal column of the present invention;

FIG. 5 is a perspective view showing the appearance of a thirdembodiment of the combined structure of a vacuum thermal chamber and twovacuum thermal towers or columns of the present invention;

FIG. 5A is a sectional view showing the third embodiment of the combinedstructure of a vacuum thermal chamber and two vacuum thermal towers orcolumns of the present invention;

FIG. 6 is a perspective view showing the appearance of a fourthembodiment of the combined structure of a vacuum thermal chamber and aninversed “U” shaped vacuum thermal tower or column of the presentinvention;

FIG. 6A is a sectional view showing the fourth embodiment of thecombined structure of a vacuum thermal chamber and an inversed “U”shaped vacuum thermal tower or column of the present invention;

FIG. 7 is a perspective view showing the appearance of a fifthembodiment of the combined structure of a vacuum thermal chamber andfour hollow heat pipes of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present invention is characterized in using the combined structureof a vacuum thermal chamber and at least a vacuum thermal tower orcolumn to increase heat conductive heat-sinking effect, and to avoiddamage or inferior function of products by overly large accumulatingheat from heat generating sources.

Referring to FIG. 2 showing a first embodiment of the combined structureof a vacuum thermal chamber and a vacuum thermal tower of the presentinvention, the structure comprises an upright hollow vacuum thermaltower or thermal column 20 and a vacuum thermal chamber or vapor chamber22 forming a base, the vacuum thermal chamber or vapor chamber 22 has onthe upper surface thereof an opening 23.

The hollow vacuum thermal tower or thermal column 20 has on the upperend thereof a vacuum sealed-opening 21, and has the other end thereofthe opened opening which is combined to the opening 23 to make theinterior spaces communicated with each other.

Thereby as shown in FIG. 2, by drawing air to make a vacuum from theupper end of the vacuum sealed-opening 21, the bottom of a flat vacuumthermal chamber or vapor chamber 22 can be connected with a CPU of acomputer, a projector, an LCD color monitor, a TV set and other heatgenerating electronic products; and heat can be fast scattered throughthe flat vacuum thermal chamber or vapor chamber 22 and the cylindricalvacuum thermal tower or thermal column 20.

Referring FIGS. 3 and 4 showing a second embodiment of the presentinvention, the structure comprises an upright hollow cylindrical vacuumthermal column 20, a flat vacuum thermal chamber or vapor chamber 22 anda plurality of heat sinking fins 26.

The upright hollow cylindrical vacuum thermal tower or thermal column 20is combined at the periphery thereof with a plurality of heat sinkingfins 26 parallel to the flat vacuum thermal chamber or vapor chamber 22to increase the area and the effect of heat scattering.

Referring FIGS. 5 and 5A showing a third embodiment of the presentinvention, the structure comprises: a hollow vacuum thermal chamber orvapor chamber 22 forming a base, the vacuum thermal chamber or vaporchamber 22 has on the upper surface thereof two openings 23; twocylindrical vacuum thermal towers or thermal columns 28, 30 respectivelycombined with the two openings 23, the interior space thereof iscommunicated with the interior space of the hollow vacuum thermalchamber or vapor chamber 22; and a plurality of heat sinking fins 26combined with the peripheries of the two cylindrical vacuum thermaltower or thermal column 28, 30, and parallel to the vacuum thermalchamber or vapor chamber 22. When in practicing, the vacuumsealed-opening 21 can be provided on the upper end of either of the twocylindrical vacuum thermal tower or thermal column 28, 30, or can beprovided on a side of the vacuum thermal chamber or vapor chamber 22.

Referring FIGS. 6 and 6A showing a fourth embodiment of the presentinvention, the structure comprises: an inversed “U” shaped vacuumthermal column 29, a plurality of heat sinking fins 26 and a vacuumthermal chamber or vapor chamber 22; the inversed “U” shaped vacuumthermal column 29 is formed by bending of a straight vacuum thermalcolumn. In the present embodiment of the present invention, a vacuumsealed-opening 25 is provided on one side of the vacuum thermal chamberor vapor chamber 22.

Referring to FIG. 7 showing a fifth embodiment of the present invention,the structure comprises: a vacuum thermal chamber or vapor chamber 22forming a base, it has at the four corners on the upper surface thereoffour openings; four hollow heat pipes all with a smaller diameter arecombined respectively with the four openings of the vacuum thermalchamber or vapor chamber 22, the interior space thereof are communicatedwith the interior space of the vacuum thermal chamber or vapor chamber22; a plurality of heat sinking fins 27 combined with the peripheries ofthe four hollow heat pipes, the heat sinking fins 27 are parallel to thebase or the vacuum thermal chamber or vapor chamber 22, an opening 271is formed centrally of the heat sinking fins 27 to get all the waythrough from the top to the bottom of them and to increase the effect ofheat sinking.

Therefore, by drawing air to make a vacuum, the flat vacuum thermalchamber or vapor chamber 22 in the form of the base can be combined onthe bottom thereof with a heat generating electronic device; heat can beeffectively scattered through the combined structure stated above, andthereby the life of use of the electronic device can be elongated.

The present invention thereby has the following advantages:

-   -   1. After drawing air to make a vacuum of a conventional upright        thermal tower, a plate is welded to the bottom of the thermal        tower to increase the contact area of the thermal tower with a        heat generating body to increase the effect of heat sinking;        however, the speed of heat sinking of it is far smaller than        that of the combined structure of a vacuum thermal chamber and a        vacuum thermal tower of the present invention having the        interior spaces of them mutually communicated, thereby, the        present invention has higher efficiency of heat sinking.    -   2. The interior spaces of the vacuum thermal chamber and the        vacuum thermal tower of the present invention are mutually        communicated, so that the vacuum sealed-opening of the present        invention can be provided on the upper end of the vacuum thermal        tower, or on a side of the vacuum thermal chamber, thus the        present invention is more convenient in operation.

In conclusion, the present invention can surely get its expected objectto provide a vacuum heat-sinking device. The embodiments given are onlyfor illustrating the present invention, and not for giving anylimitation to the scope of the present invention. It will be apparent tothose skilled in this art that various modifications or changes withoutdeparting from the spirit of this invention shall also fall within thescope of the appended claims. Having now particularly described andascertained the nature of the present invention having its industrialvalue, we declare that what we claim are:

1. A combined structure of a thermal chamber and a thermal tower, saidstructure comprises: a hollow vacuum thermal chamber forming a base, ofwhich an upper surface is provided at least with an opening; and atleast a vacuum thermal tower combined with said opening of said vacuumthermal chamber, the inner spaces of said thermal chamber and saidthermal tower are communicated with each other; thereby, heat isconducted and scattered through said thermal chamber and said thermaltower.
 2. The combined structure of a thermal chamber and a thermaltower as in claim 1, wherein: said vacuum thermal tower has on an upperend thereof a vacuum sealed-opening.
 3. The combined structure of athermal chamber and a thermal tower as in claim 1, wherein: a vacuumsealed-opening is provided on a side of said vacuum thermal chamber. 4.The combined structure of a thermal chamber and a thermal tower as inclaim 1, wherein: the bottom of said vacuum thermal chamber is connectedwith a heat generating body in use.
 5. The combined structure of athermal chamber and a thermal tower as in claim 1, wherein: said vacuumthermal tower is upright and is provided at the periphery thereof with aplurality of heat sinking fins to increase heat sinking function.
 6. Thecombined structure of a thermal chamber and a thermal tower as in claim1, wherein: said vacuum thermal tower is a vacuum thermal tower or avacuum thermal column having air therein drawn to make a vacuum.
 7. Thecombined structure of a thermal chamber and a thermal tower as in claim1, wherein: said vacuum thermal tower is an inversed “U” shaped vacuumthermal tower.
 8. The combined structure of a thermal chamber and athermal tower as in claim 1, wherein: said thermal tower includes aplurality of heat pipes all of a smaller diameter.
 9. The combinedstructure of a thermal chamber and a thermal tower as in claim 8,wherein: said heat pipes are embedded in a plurality of heat sinkingfins with an opening provided centrally thereof.